MEMS Chip Design Engineer
Release time:
2023-02-20
Source:
Job Description:
MEMS chip design, processing, sealing and testing process tracking;
MEMS chip system modeling, simulation optimization design;
MEMS chip layout, process formulation, new process development;
MEMS chip package test, data analysis, summary report preparation.
We need you to:
Master degree or above, major in microelectronics, semiconductor, applied physics, mathematics or related;
MEMS device related project process participants are preferred;
Proficient in using ANSYS, Silvaco, Cadence, Comsol and other development tools, proficient in using chip test instruments such as signal generators, oscilloscopes, spectrum analyzers, etc.
Have research and design experience of pressure sensor and inertial device, understand MEMS process flow, process equipment and semiconductor device physics, etc.
Good team work ability and good English reading and writing ability.
Work location: Xinzhongguan Building, Haidian District, Beijing
Resume to receive: hel@isensing.cn
If you have any questions, please enter your phone number and we will contact you.
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